Assembly Technologies Device Engineer
STMicroelectronics
Agrate, Italy
1 gg fa

Job description

To develop packages and / or processes in compliance with customer requirements and to propose advanced packaging solutions to sustain divisional business.

To manage the overall packaging / assembly activities related to new product development

To provide technical expertise on package field, assisting division in matters affecting technical decisions.

Negotiate the overall product definition with Customer and / or divisional representative

Define the Project Timeline, monitor the actual status and implement actions of correction if needed

Profile

Package Development, Project Management, Risk Analysis, DOE (Design of Experiment), Qualification Methodology, Management Of Priorities, Interpersonal Relationships.

Knowledge of package technology, especially QFN and WLCSP

Available for business trip

Candidate criteria

Education level required

4 - Bachelor degree

Experience level required

Languages

English (2- Business fluent)

01 / 01 / 2020

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